The new SAF ReLife solution allows manufacturers to transform waste PA12 powder into high-quality parts, cutting production costs and reducing carbon emissions by up to 89%, according to Fraunhofer IPA's life cycle assessment.
Dual 700-watt lasers with Automatic Multilaser Alignment (AMA) and integrated cooling ensure efficient volume production and stronger parts for the TruPrint 3000 3D printer.
3D Systems will showcase advanced printing technologies and materials engineered to help customers meet a variety of application needs and accelerate innovation at Formnext 2024.
MAPAL leverages component and market expertise to provide optimal electromobility machining solutions, integrating trends for key parts like scroll compressors.
The latest version of Renishaw's CARTO software (v4.12) now includes analysis-based data stitch functionality for long axis measurements using the XK10 alignment laser system.
Seco has launched an innovative web-based tool that provides customers with product-specific, instant, high-quality cutting data recommendations based on their machine information. The Seco Machine Library simplifies the process of identifying, purchasing and optimizing tools that are appropriate for specific machines.
Semiconductor manufacturers can reduce scrap and thus cut costs. Additive manufactured parts improve the overall performance of semiconductor manufacturing machines.
The newly addition features a 35-degree corner angle, enabling it to tackle wall and bottom machining in narrow grooving areas where traditional V-shaped ISO inserts would typically interfere.